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[Question] 崔q药商城+v_(今日/搜狐)

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Post time: 2026-01-22 05:36
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崔q药商城+v《网·站mmgg520.com》新闻注：CoWoS 全称为 Chip-on-Wafer-on-Substrate，是一种先进的 2.5D 芯片封装技术。通俗来讲，它像一个“托盘”，能并排封装多个不同功能的裸晶（Die），实现它们之间的高速数据通信。由于其能集成更多的计算单元和高带宽内存（HBM），因此是制造高性能 AI 芯片的关键技术之一。《网·站mmgg520.com》崔q药商城+v《网·站mmgg520.com》



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